Semiconductor Packaging News59m
IFTLE 616: Broadcom eXtreme Dimension System in Package (XDSiP™)
Summary Broadcom unveiled its 3.5D XDSiP™ platform, combining TSMC's CoWoS packaging and 3D silicon stacking for next-gen AI accelerators. Supporting up to 6000mm² SiPs with 12 HBM modules, it targets ...
Semiconductor Packaging News50m
Dell picks AMD for business PCs
Summary AMD unveiled its Ryzen AI Max processors, powering Dell’s business PCs for the first time, claiming unmatched AI performance and a 90% speed boost. The move challenges Intel’s dominance as AMD ...
Semiconductor Packaging News1h
Global Semiconductor Sales Increase 20.7% Year-to-Year in November
Global Semiconductor Sales Increase 20.7% Year-to-Year in November: Summary Global semiconductor sales soared to $57.8 billion in November 2024, marking a 20.7% year-over-year sur ...
Semiconductor Packaging News1h
MediaTek, Nvidia to develop new AI chip
Summary MediaTek and Nvidia are collaborating on the GB10 Grace Blackwell superchip for Project Digits, the world’s smallest AI supercomputer. Targeting AI researchers and students, the chip aims to ...
Semiconductor Packaging News1h
Research Bits: Jan. 7
Researchers globally advanced technology with innovative breakthroughs. A Hong Kong-led team developed a groundbreaking aluminum gallium nitride deep-UV microLED display for maskless lithography, ...